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BYC10-600
Hyperfast power diode
20 September 2012
Product data sheet
1. Product profile
1.1 General description
Hyperfast power diode in a SOD59 (2-lead TO-220AC) plastic package 1.2 Features and benefits
• Reduces switching losses in associated MOSFET 1.3 Applications
• Continuous Current Mode (CCM) Power Factor Correction (PFC) • Half-bridge/full-bridge switched-mode power supplies 1.4 Quick reference data
Quick reference data
Parameter
Conditions
Static characteristics
VF
Dynamic characteristics
trr
NXP Semiconductors
BYC10-600
Hyperfast power diode
2. Pinning information
Pinning information
Symbol Description
Simplified outline
Graphic symbol
TO-220AC (SOD59)
3. Ordering information
Ordering information
Type number
Package
Name

Description
plastic single-ended package; heatsink mounted; 1 mounting 4. Limiting values
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Parameter
Conditions
repetitive peak forward current δ = 0.5 ; Tmb ≤ 78 °C; square-wave pulsetp = 8.3 ms; Tj(init) = 25 °C; sine-wave All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
Fig. 1. Forward power dissipation as a function of
Fig. 2. Forward power dissipation as a function of
average forward current; square waveform;
average forward current; sinusoidal waveform;
maximum values
maximum values
5. Thermal characteristics
Thermal characteristics
Parameter
Conditions
Fig. 3. Transient thermal impedance from junction to mounting base as a function of pulse width
All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
6. Characteristics
Characteristics
Parameter
Conditions
Static characteristics
VF
Dynamic characteristics
trr
Tj = 25 °C; IF = 10 A; VR = 400 V; dIF/dt = 500 A/s; Tj = 25 °C; IF = 10 A; VR = 400 V; dIF/dt = 500 A/s; peak reverse recovery IF = 10 A; VR = 400 V; dIF/dt = 100 A/s; TjIF = 10 A; VR = 400 V; dIF/dt = 500 A/s; IF = 10 A; dIF/dt = 100 A/s; Tj = 25 °C; All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
Fig. 4. Forward current as a function of forward
Fig. 5. Reverse leakage current as a function of
reverse voltage; typical values
Fig. 6. Reverse recovery definitions; ramp recovery
Fig. 7. Forward recovery definitions
All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC
max 4.7 1.40 0.95 1.7 0.65 15.8 6.8 10.30 1. Protruded dambar are included in the dimension.
Fig. 8. Package outline TO-220AC (SOD59)
All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - 8. Legal information
lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of 8.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards Document
Definition
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Development This document contains data from Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without Qualification This document contains data from the notice. This document supersedes and replaces all information supplied prior Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental Please consult the most recently issued document before initiating or damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or The term 'short data sheet' is explained in section "Definitions".
applications and therefore such inclusion and/or use is at the customer’s own The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on Quick reference data — The Quick reference data is an extract of the
the Internet at URL http://www.nxp.com.
product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
8.2 Definitions
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the Preview — The document is a preview version only. The document is still
specified use without further testing or modification.
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to Customers are responsible for the design and operation of their the accuracy or completeness of information included herein and shall have applications and products using NXP Semiconductors products, and NXP no liability for the consequences of use of such information.
Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine Draft — The document is a draft version only. The content is still under
whether the NXP Semiconductors product is suitable and fit for the internal review and subject to formal approval, which may result in customer’s applications and products planned, as well as for the planned modifications or additions. NXP Semiconductors does not give any application and use of customer’s third party customer(s). Customers should representations or warranties as to the accuracy or completeness of provide appropriate design and operating safeguards to minimize the risks information included herein and shall have no liability for the consequences associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, Short data sheet — A short data sheet is an extract from a full data sheet
damage, costs or problem which is based on any weakness or default with the same product type number(s) and title. A short data sheet is in the customer’s applications or products, or the application or use by intended for quick reference only and should not be relied upon to contain customer’s third party customer(s). Customer is responsible for doing all detailed and full information. For detailed and full information see the necessary testing for the customer’s applications and products using NXP relevant full data sheet, which is available on request via the local NXP Semiconductors products in order to avoid a default of the applications Semiconductors sales office. In case of any inconsistency or conflict with the and the products or of the application or use by customer’s third party short data sheet, the full data sheet shall prevail.
customer(s). NXP does not accept any liability in this respect.
Product specification — The information and data provided in a Product
Limiting values — Stress above one or more limiting values (as defined in
data sheet shall define the specification of the product as agreed between the Absolute Maximum Ratings System of IEC 60134) will cause permanent NXP Semiconductors and its customer, unless NXP Semiconductors and damage to the device. Limiting values are stress ratings only and (proper) customer have explicitly agreed otherwise in writing. In no event however, operation of the device at these or any other conditions above those shall an agreement be valid in which the NXP Semiconductors product given in the Recommended operating conditions section (if present) or the is deemed to offer functions and qualities beyond those described in the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
8.3 Disclaimers
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial Limited warranty and liability — Information in this document is believed
agreed in a valid written individual agreement. In case an individual to be accurate and reliable. However, NXP Semiconductors does not give agreement is concluded only the terms and conditions of the respective any representations or warranties, expressed or implied, as to the accuracy agreement shall apply. NXP Semiconductors hereby expressly objects to or completeness of such information and shall have no liability for the applying the customer’s general terms and conditions with regard to the consequences of use of such information. NXP Semiconductors takes no purchase of NXP Semiconductors products by customer.
responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
8.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012
NXP Semiconductors
BYC10-600
Hyperfast power diode
9. Contents
1

NXP B.V. 2012. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 September 2012
All information provided in this document is subject to legal disclaimers.
Product data sheet
20 September 2012

Source: http://imrad.kiev.ua/pdf/diod_vipryamitelniy/BYC10600_NXP.pdf

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