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Bta216 series d, e and f three quadrant triacs guaranteed commutation

DISCRETE SEMICONDUCTORS
DATA SHEET
BTA216 series D, E and F
NXP Semiconductors
Product specification
Three quadrant triacs
BTA216 series D, E and F
guaranteed commutation
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Passivated guaranteed commutation triacs in PARAMETER
a plastic envelope intended for use in motorcontrol circuits or with other highly inductive and gate sensitivity. The "sensitive gate" E series and "logic level" D series are intended PINNING - TO220AB
PIN CONFIGURATION
DESCRIPTION
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
PARAMETER
CONDITIONS
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
THERMAL RESISTANCES
PARAMETER
CONDITIONS
STATIC CHARACTERISTICS
T = 25 ˚C unless otherwise stated
PARAMETER
CONDITIONS
DYNAMIC CHARACTERISTICS
T = 25 ˚C unless otherwise stated
PARAMETER
CONDITIONS
2 Device does not trigger in the T2-, G+ quadrant.
Fig.1. Maximum on-state dissipation, P , versus rms Fig.4. Maximum permissible rms current I versus mounting base temperature T . Fig.2. Maximum permissible non-repetitive peak Fig.5. Maximum permissible repetitive rms on-state , versus surge duration, for sinusoidal Fig.3. Maximum permissible non-repetitive peak Fig.6. Normalised gate trigger voltage V (T )/ V (25˚C), versus junction temperature T . Fig.7. Normalised gate trigger current Fig.10. Typical and maximum on-state characteristic. I (T )/ I (25˚C), versus junction temperature T .
Fig.8. Normalised latching current I (T )/ I (25˚C), Fig.11. Transient thermal impedance Z versus junction temperature T .
Fig.9. Normalised holding current I (T )/ I (25˚C), Fig.12. Minimum, critical rate of change of versus junction temperature T .
MECHANICAL DATA
Fig.13. SOT78 (TO220AB). pin 2 connected to mounting base. Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
DATA SHEET STATUS
DOCUMENT
DEFINITION
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DEFINITIONS
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
Product specification ⎯ The information and data
published in this document, including without limitation provided in a Product data sheet shall define the specifications and product descriptions, at any time and specification of the product as agreed between NXP without notice. This document supersedes and replaces all Semiconductors and its customer, unless NXP information supplied prior to the publication hereof.
Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an Suitability for use ⎯ NXP Semiconductors products are
agreement be valid in which the NXP Semiconductors not designed, authorized or warranted to be suitable for product is deemed to offer functions and qualities beyond use in life support, life-critical or safety-critical systems or those described in the Product data sheet.
equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe DISCLAIMERS
property or environmental damage. NXP Semiconductors Limited warranty and liability ⎯ Information in this
accepts no liability for inclusion and/or use of NXP document is believed to be accurate and reliable. Semiconductors products in such equipment or However, NXP Semiconductors does not give any applications and therefore such inclusion and/or use is at representations or warranties, expressed or implied, as to the accuracy or completeness of such information and Applications ⎯ Applications that are described herein for
shall have no liability for the consequences of use of such any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or In no event shall NXP Semiconductors be liable for any warranty that such applications will be suitable for the indirect, incidental, punitive, special or consequential specified use without further testing or modification. damages (including - without limitation - lost profits, lost Customers are responsible for the design and operation of savings, business interruption, costs related to the their applications and products using NXP removal or replacement of any products or rework Semiconductors products, and NXP Semiconductors charges) whether or not such damages are based on tort accepts no liability for any assistance with applications or (including negligence), warranty, breach of contract or any customer product design. It is customer’s sole responsibility to determine whether the NXP Notwithstanding any damages that customer might incur Semiconductors product is suitable and fit for the for any reason whatsoever, NXP Semiconductors’ customer’s applications and products planned, as well as aggregate and cumulative liability towards customer for for the planned application and use of customer’s third the products described herein shall be limited in party customer(s). Customers should provide appropriate accordance with the Terms and conditions of commercial design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related that is open for acceptance or the grant, conveyance or to any default, damage, costs or problem which is based implication of any license under any copyrights, patents or on any weakness or default in the customer’s applications other industrial or intellectual property rights.
or products, or the application or use by customer’s third Export control ⎯ This document as well as the item(s)
party customer(s). Customer is responsible for doing all described herein may be subject to export control necessary testing for the customer’s applications and regulations. Export might require a prior authorization from products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party Quick reference data ⎯ The Quick reference data is an
customer(s). NXP does not accept any liability in this extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
Non-automotive qualified products ⎯ Unless this data
System of IEC 60134) will cause permanent damage to sheet expressly states that this specific NXP the device. Limiting values are stress ratings only and Semiconductors product is automotive qualified, the (proper) operation of the device at these or any other product is not suitable for automotive use. It is neither conditions above those given in the Recommended qualified nor tested in accordance with automotive testing operating conditions section (if present) or the or application requirements. NXP Semiconductors accepts Characteristics sections of this document is not warranted. no liability for inclusion and/or use of non-automotive Constant or repeated exposure to limiting values will qualified products in automotive equipment or permanently and irreversibly affect the quality and In the event that customer uses the product for design-in Terms and conditions of commercial sale ⎯ NXP
and use in automotive applications to automotive Semiconductors products are sold subject to the general specifications and standards, customer (a) shall use the terms and conditions of commercial sale, as published at product without NXP Semiconductors’ warranty of the http://www.nxp.com/profile/terms, unless otherwise product for such automotive applications, use and agreed in a valid written individual agreement. In case an specifications, and (b) whenever customer uses the individual agreement is concluded only the terms and product for automotive applications beyond NXP conditions of the respective agreement shall apply. NXP Semiconductors’ specifications such use shall be solely at Semiconductors hereby expressly objects to applying the customer’s own risk, and (c) customer fully indemnifies customer’s general terms and conditions with regard to the NXP Semiconductors for any liability, damages or failed purchase of NXP Semiconductors products by customer.
product claims resulting from customer design and use of the product for automotive applications beyond NXP No offer to sell or license ⎯ Nothing in this document
Semiconductors’ standard warranty and NXP may be interpreted or construed as an offer to sell products Semiconductors’ product specifications.
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This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. Contact information
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